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19-3648; Rev 0; 4/05
KIT ATION EVALU ILABLE AVA
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch
General Description
The MAX9984 high-linearity downconversion mixer provides 8.1dB gain, +25dBm IIP3, and 9.3dB NF for 400MHz to 1000MHz base-station receiver applications*. With an optimized 570MHz to 850MHz LO frequency range, this particular mixer is ideal for low-side LO injection receiver architectures in the cellular band. High-side LO injection is supported by the MAX9986, which is pin-for-pin and functionally compatible with the MAX9984. In addition to offering excellent linearity and noise performance, the MAX9984 also yields a high level of component integration. This device includes a double-balanced passive mixer core, an IF amplifier, a dual-input LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9984 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 265mA. The MAX9984/MAX9986 are pin compatible with the MAX9994/MAX9996 1700MHz to 2200MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for both frequency bands. The MAX9984 is also functionally compatible with the MAX9993. The MAX9984 is available in a compact, 20-pin, thin QFN package (5mm x 5mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40C to +85C temperature range.
Features
400MHz to 1000MHz RF Frequency Range* 325MHz to 850MHz LO Frequency Range* (MAX9984) 960MHz to 1180MHz LO Frequency Range (MAX9986) 50MHz to 250MHz IF Frequency Range 8.1dB Conversion Gain +25dBm Input IP3 +13dBm Input 1dB Compression Point 9.3dB Noise Figure 71dBc 2RF-2LO Spurious Rejection at PRF = -10dBm Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 54dB LO1 to LO2 Isolation and 50ns Switching Time Pin Compatible with MAX9994/MAX9996 1700MHz to 2200MHz Mixers Functionally Compatible with MAX9993 External Current-Setting Resistors Provide Option for Operating Mixer in Reduced Power/Reduced Performance Mode Lead-Free Package Available
MAX9984
Applications
850MHz W-CDMA Base Stations GSM 850/GSM 900 2G and 2.5G EDGE Base Stations cdmaOneTM and cdma2000(R) Base Stations iDEN(R) Base Stations 400MHz to 700MHz OFDM/WiMAX CPE and Base-Station Equipment Predistortion Receivers Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radios Military Systems Microwave Links Digital and Spread-Spectrum Communication Systems
cdma2000 is a registered trademark of the Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. iDEN is a registered trademark of Motorola, Inc.
Ordering Information
PART MAX9984ETP MAX9984ETP-T MAX9984ETP+D TEMP RANGE PIN-PACKAGE -40C to +85C -40C to +85C -40C to +85C PKG CODE
20 Thin QFN-EP** T2055-3 5mm x 5mm 20 Thin QFN-EP** T2055-3 5mm x 5mm 20 Thin QFN-EP** T2055-3 5mm x 5mm 20 Thin QFN-EP** T2055-3 5mm x 5mm
MAX9984ETP+TD -40C to +85C
*For an RF frequency range below 815MHz (LO frequency below 570MHz), appropriate tuning is required. See Table 2 for details. **EP = Exposed paddle. + = Lead free. D = Dry pack. T = Tape-and-reel. Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet. 1
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +5.5V IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V) TAP ........................................................................-0.3V to +1.4V LO1, LO2, LEXT to GND........................................-0.3V to +0.3V RF, LO1, LO2 Input Power .............................................+12dBm RF (RF is DC shorted to GND through a balun) .................50mA Continuous Power Dissipation (TA = +70C) 20-Pin Thin QFN-EP (derate 26.3mW/C above +70C)...........2.1W Note A: TC is the temperature on the exposed paddle of the package.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
JA .................................................................................+38C/W JC .................................................................................+13C/W Operating Temperature Range (Note A) ....TC = -40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
DC ELECTRICAL CHARACTERISTICS
(MAX9984 Typical Application Circuit, using component values in Table 1, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through inductive chokes, R1 = 953, R2 = 619, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.)
PARAMETER Supply Voltage Supply Current LO_SEL Input-Logic Low LO_SEL Input-Logic High SYMBOL VCC ICC VIL VIH 2 CONDITIONS MIN 4.75 TYP 5.00 222 MAX 5.25 265 0.8 UNITS V mA V V
AC ELECTRICAL CHARACTERISTICS
(MAX9984 Typical Application Circuit, using component values in Table 1, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 815MHz to 1000MHz, fLO = 570MHz to 850MHz, fIF = 160MHz, fRF > fLO, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 910MHz, fLO = 750MHz, fIF = 160MHz, TC = +25C, unless otherwise noted.) (Note 1)
PARAMETER RF Frequency Range SYMBOL fRF (Note 2) (Notes 2, 3) (Note 2) LO Frequency Range IF Frequency Range Conversion Gain Gain Variation Over Temperature fLO fIF GC (Notes 2, 3) MAX9986 (Note 2) fRF = 910MHz, fLO = 750MHz, TC = +25C TC = -40C to +85C Flatness over any one of three frequency bands: fRF = 824MHz to 849MHz fRF = 869MHz to 894MHz fRF = 880MHz to 915MHz P1dB (Note 4) fLO = 570MHz to 850MHz, fIF = 160MHz, PLO = 0dBm, TC = +25C (Note 5) Input Third-Order Intercept Point IIP3 Two tones: fRF1 = 910MHz, fRF2 = 911MHz, PRF = -5dBm/tone, fLO = 750MHz, PLO = 0dBm, TC = +25C 19 dBm 22 25 CONDITIONS MIN 815 400 570 325 960 50 7.2 8.1 -0.0079 1180 250 9.2 MHz dB dB/C 850 MHz TYP MAX 1000 UNITS MHz
Conversion Gain Flatness
0.25
dB
Input Compression Point
13
dBm
2
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SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9984 Typical Application Circuit, using component values in Table 1, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 815MHz to 1000MHz, fLO = 570MHz to 850MHz, fIF = 160MHz, fRF > fLO, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 910MHz, fLO = 750MHz, fIF = 160MHz, TC = +25C, unless otherwise noted.) (Note 1)
PARAMETER Input IP3 Variation Over Temperature Noise Figure NF SYMBOL CONDITIONS TC = +25C to -40C TC = +25C to +85C Single sideband, fIF = 190MHz fRF = 900MHz (no signal) fLO = 1090MHz fBLOCKER = 981MHz fIF = 190MHz (Note 6) PBLOCKER = +8dBm PBLOCKER = +11dBm MIN TYP -1.5 +0.8 9.3 19 dB 24 MAX UNITS dB dB
MAX9984
Noise Figure Under-Blocking
Small-Signal Compression Under-Blocking Condition LO Drive 2x2 Spurious Response at IF 3x3 LO1 to LO2 Isolation LO Leakage at RF Port LO Leakage at IF Port RF-to-IF Isolation LO Switching Time RF Port Return Loss
PBLOCKER = PFUNDAMENTAL = -5dBm +8dBm fFUNDAMENTAL = 910MHz PBLOCKER = fBLOCKER = 911MHz +11dBm -3 2RF-2LO 3RF-3LO PLO = +3dBm TC = +25C (Note 5) PLO = +3dBm PLO = +3dBm PLO = +3dBm 50% of LOSEL to IF settled to within 2 LO1/2 port selected, LO2/1 and IF terminated PRF = -10dBm PRF = -5dBm PRF = -10dBm PRF = -5dBm LO2 selected LO1 selected 47 47
0.25 dB 0.6 +3 71 66 87 82 54 60 -32 -23 54 50 14 23 dB 20 16 dB dB dBm dBm dB ns dB dBc dBm
LO Port Return Loss LO1/2 port unselected, LO2/1 and IF terminated IF Port Return Loss LO driven at 0dBm, RF terminated into 50, differential 200
Note 1: All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit. Note 2: Operation outside this range is possible, but with degraded performance of some parameters. Note 3: See Table 2 for component list required for 400MHz to 500MHz operation. For operation from 500MHz to 800MHz, appropriate tuning is required; please contact the factory for support. Note 4: Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm. Note 5: Guaranteed by design and characterization. Note 6: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
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3
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
Typical Operating Characteristics
(MAX9984 Typical Application Circuit, using component values in Table 1, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF > fLO, fIF = 160MHz, unless otherwise noted.)
CONVERSION GAIN vs. RF FREQUENCY
MAX9984 toc01
CONVERSION GAIN vs. RF FREQUENCY
MAX9984 toc02
CONVERSION GAIN vs. RF FREQUENCY
MAX9984 toc03
11
11
11
10 CONVERSION GAIN (dB) TC = -25C 9
CONVERSION GAIN (dB)
9
CONVERSION GAIN (dB)
TC = -40C
10
10
9
8 TC = +25C
8 PLO = -3dBm, 0dBm, +3dBm 7
8 VCC = 4.75V, 5.0V, 5.25V
7
TC = +85C
7
6 700 800 900 1000 1100 RF FREQUENCY (MHz)
6 700 800 900 1000 1100 RF FREQUENCY (MHz)
6 700 800 900 1000 1100 RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
MAX9984 toc04
INPUT IP3 vs. RF FREQUENCY
MAX9984 toc05
INPUT IP3 vs. RF FREQUENCY
VCC = 4.75V VCC = 5.25V
MAX9984 toc06
27 26 25 INPUT IP3 (dBm) TC = +85C
27 26 25 INPUT IP3 (dBm) 24 23 22 PLO = -3dBm, 0dBm, +3dBm
26 25 24 INPUT IP3 (dBm) 23 22 21 20 19 VCC = 5.0V
24 23 TC = -25C 22 21 20 700 800 900 1000 1100 RF FREQUENCY (MHz) TC = -40C TC = +25C
21 20 700 800 900 1000 1100 RF FREQUENCY (MHz)
700
800
900
1000
1100
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
TC = +25C
MAX9984 toc07
NOISE FIGURE vs. RF FREQUENCY
MAX9984 toc08
NOISE FIGURE vs. RF FREQUENCY
MAX9984 toc09
12 11 NOISE FIGURE (dB) 10 9 8 7 6 5 700 800 900 TC = -25C TC = -40C TC = +85C
12 11 NOISE FIGURE (dB) 10 9 8 7 6 5 PLO = -3dBm, 0dBm, +3dBm
12 11 NOISE FIGURE (dB) 10 9 8 7 6 5 VCC = 4.75V, 5.0V, 5.25V
1000
700
800
900
1000
700
800
900
1000
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
4
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SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9984 Typical Application Circuit, using component values in Table 1, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF > fLO, fIF = 160MHz, unless otherwise noted.)
2RF-2LO RESPONSE vs. RF FREQUENCY
MAX9984 toc10
MAX9984
2RF-2LO RESPONSE vs. RF FREQUENCY
MAX9984 toc11
2RF-2LO RESPONSE vs. RF FREQUENCY
PRF = -5dBm VCC = 4.75V VCC = 5.0V
MAX9984 toc12
75 70 2RF-2LO RESPONSE (dBc) 65 60
PRF = -5dBm TC = +85C
75 70 2RF-2LO RESPONSE (dBc) 65 60
PRF = -5dBm
80 75 2RF-2LO RESPONSE (dBc) 70 65 60 55 50 45
PLO = -3dBm
TC = +25C 55 50 45 700 800 900 1000 1100 RF FREQUENCY (MHz) TC = -25C, -40C
PLO = +3dBm 55 50 45 700 800 900 1000 1100 RF FREQUENCY (MHz) PLO = 0dBm
VCC = 5.25V
700
800
900
1000
1100
RF FREQUENCY (MHz)
3RF-3LO RESPONSE vs. RF FREQUENCY
MAX9984 toc13
3RF-3LO RESPONSE vs. RF FREQUENCY
MAX9984 toc14
3RF-3LO RESPONSE vs. RF FREQUENCY
PRF = -5dBm VCC = 5.25V
MAX9984 toc15
95
PRF = -5dBm
95
TC = +85C
PRF = -5dBm
95
3RF-3LO RESPONSE (dBc)
3RF-3LO RESPONSE (dBc)
85
85
3RF-3LO RESPONSE (dBc)
85
75
TC = -40C TC = -25C
75
75
VCC = 4.75V VCC = 5.0V
65
TC = +25C
65
PLO = -3dBm, 0dBm, +3dBm
65
55 700 800 900 1000 1100 RF FREQUENCY (MHz)
55 700 800 900 1000 1100 RF FREQUENCY (MHz)
55 700 800 900 1000 1100 RF FREQUENCY (MHz)
INPUT P1dB vs. RF FREQUENCY
MAX9984 toc16
INPUT P1dB vs. RF FREQUENCY
MAX9984 toc17
INPUT P1dB vs. RF FREQUENCY
MAX9984 toc18
15 TC = -25C 14 INPUT P1dB (dBm) 13 12 11 TC = -40C 10 9 700 800 900 1000 TC = +85C TC = +25C
15 14 INPUT P1dB (dBm) 13 12 11 10 9
15 14 INPUT P1dB (dBm) 13 12 11 10 9 VCC = 4.75V VCC = 5.0V VCC = 5.25V
PLO = -3dBm, 0dBm, +3dBm
1100
700
800
900
1000
1100
700
800
900
1000
1100
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
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5
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
Typical Operating Characteristics (continued)
(MAX9984 Typical Application Circuit, using component values in Table 1, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF > fLO, fIF = 160MHz, unless otherwise noted.)
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9984 toc19
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9984 toc20
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9984 toc21
60 TC = -25C, -40C LO SWITCH ISOLATION (dB) 55
60
60
LO SWITCH ISOLATION (dB)
55
LO SWITCH ISOLATION (dB)
55 VCC = 4.75V, 5.0V, 5.25V 50
50
TC = +85C TC = +25C
50
PLO = -3dBm, 0dBm, +3dBm
45
45
45
40 540 640 740 840 940 LO FREQUENCY (MHz)
40 540 640 740 840 940 LO FREQUENCY (MHz)
40 540 640 740 840 940 LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9984 toc22
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9984 toc23
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
VCC = 5.0V VCC = 5.25V LO LEAKAGE (dBm) -20 -25 -30 -35 -40
MAX9984 toc24
-10 TC = -25C, -40C -15 LO LEAKAGE (dBm) -20 TC = +85C -25 -30 -35 -40 540 640 740 840 TC = +25C
-10 -15 PLO = 0dBm, +3dBm LO LEAKAGE (dBm) -20 -25 -30 -35 -40 PLO = -3dBm
-10 -15
VCC = 4.75V
940
540
640
740
840
940
540
640
740
840
940
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9984 toc25
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9984 toc26
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9984 toc27
-10
-10
-10
LO LEAKAGE AT RF PORT (dBm)
LO LEAKAGE AT RF PORT (dBm)
-20 TC = -25C, -40C -30
-20
LO LEAKAGE AT RF PORT (dBm)
-20
-30 PLO = -3dBm, 0dBm, +3dBm -40
-30
-40 TC = +25C TC = +85C -50 540 640 740 840 940 LO FREQUENCY (MHz)
-40
VCC = 4.75V, 5.0V, 5.25V
-50 540 640 740 840 940 LO FREQUENCY (MHz)
-50 540 640 740 840 940 LO FREQUENCY (MHz)
6
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SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9984 Typical Application Circuit, using component values in Table 1, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF > fLO, fIF = 160MHz, unless otherwise noted.)
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9984 toc28
MAX9984
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9984 toc29
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX9984 toc30
60 TC = -40C 55 RF-TO-IF ISOLATION (dB) 50 45 40 TC = +25C 35 30 700 800 900 1000 TC = +85C TC = -25C
60 55 RF-TO-IF ISOLATION (dB) 50 45 40 PLO = -3dBm, 0dBm, +3dBm 35 30
60 55 RF-TO-IF ISOLATION (dB) 50 45 40 35 30 VCC = 5.25V VCC = 4.75V
VCC = 5.0V
1100
700
800
900
1000
1100
700
800
900
1000
1100
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF PORT RETURN LOSS vs. RF FREQUENCY
MAX9984 toc31
IF PORT RETURN LOSS vs. IF FREQUENCY
MAX9984 toc32
LO SELECTED RETURN LOSS vs. LO FREQUENCY
MAX9984 toc33
0 5 RF PORT RETURN LOSS (dB) PLO = -3dBm, 0dBm, +3dBm 10 15 20 25 30 700 800 900 1000
0 5 IF PORT RETURN LOSS (dB) 10 15 20 25 30
0 LO SELECTED RETURN LOSS (dB)
10
PLO = +3dBm PLO = 0dBm
VCC = 4.75V, 5.0V, 5.25V
20
30
PLO = -3dBm
40 50
1100
50
100
150
200
250
300
350
540
640
740
840
940
RF FREQUENCY (MHz)
IF FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS vs. LO FREQUENCY
MAX9984 toc34
SUPPLY CURRENT vs. TEMPERATURE (TC)
VCC = 5.25V SUPPLY CURRENT (mA) 230
MAX9984 toc35
0 LO UNSELECTED RETURN LOSS (dB) 5 10 15 20 25 30 540 640 740 840
240
PLO = -3dBm, 0dBm, +3dBm
220
210
VCC = 4.75V
VCC = 5.0V
200 940 -40 -15 10 35 60 85 LO FREQUENCY (MHz) TEMPERATURE (C)
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7
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
Typical Operating Characteristics
(MAX9984 Typical Application Circuit, using component values in Table 2, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fIF = 75MHz, unless otherwise noted.)
CONVERSION GAIN vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
MAX9984 toc36
INPUT IP3 vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
LOW-SIDE INJECTION, fRF > fLO TC = +85C TC = -25C
MAX9984 toc37
2RF-2LO RESPONSE vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
LOW-SIDE INJECTION, fRF > fLO PRF = -5dBm TC = +85C
MAX9984 toc38
10
LOW-SIDE INJECTION, fRF > fLO
26 25 24 INPUT IP3 (dBm) 23 22 21 20
70
9 CONVERSION GAIN (dB) TC = -40C 8
65 2RF-2LO RESPONSE (dBc)
60
7 TC = -25C 6 TC = +85C 5 400 420 440 460 480 500 RF FREQUENCY (MHz) TC = +25C
55
TC = +25C
TC = +25C TC = -40C
50
TC = -25C, -40C
19 400 420 440 460 480 500 RF FREQUENCY (MHz)
45 400 420 440 460 480 500 RF FREQUENCY (MHz)
3RF-3LO RESPONSE vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
MAX9984 toc39
RF PORT RETURN LOSS vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
MAX9984 toc40
IF PORT RETURN LOSS vs. IF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
VCC = 5.0V, PLO = 0dBm, TC = +25C LOW-SIDE INJECTION, fRF > fLO
MAX9984 toc41
75
RF PORT RETURN LOSS (dB)
IF PORT RETURN LOSS (dB)
3RF-3LO RESPONSE (dBc)
65
LOW-SIDE INJECTION, fRF > fLO PRF = -5dBm TC = +25C TC = +85C
0 5 10 15 20 25
VCC = 5.0V, PLO = 0dBm, TC = +25C LOW-SIDE INJECTION, fRF > fLO
0
10
55
TC = -25C, -40C
20
45
30
35 400 420 440 460 480 500 RF FREQUENCY (MHz)
30 400 420 440 460 480 500 RF FREQUENCY (MHz)
40 50 100 150 200 IF FREQUENCY (MHz)
LO SELECTED RETURN LOSS vs. LO FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
MAX9984 toc42
LO UNSELECTED RETURN LOSS vs. LO FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
MAX9984 toc43
CONVERSION GAIN vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
HIGH-SIDE INJECTION, fLO > fRF TC = -40C
MAX9984 toc44
0 LO SELECTED RETURN LOSS (dB) 5 10 15 20 25 30
0 LO UNSELECTED RETURN LOSS (dB) 5 10 15 20 25 30
VCC = 5.0V, PLO = 0dBm, TC = +25C LOW-SIDE INJECTION, fRF > fLO
VCC = 5.0V, PLO = 0dBm, TC = +25C LOW-SIDE INJECTION, fRF > fLO
10
9 CONVERSION GAIN (dB)
8 TC = -25C TC = +25C 6 TC = +85C
7
5 325 345 365 385 405 425 400 420 440 460 480 500 LO FREQUENCY (MHz) RF FREQUENCY (MHz)
325
345
365
385
405
425
LO FREQUENCY (MHz)
8
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SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
Typical Operating Characteristics (continued)
(MAX9984 Typical Application Circuit, using component values in Table 2, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fIF = 75MHz, unless otherwise noted.)
INPUT IP3 vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
HIGH-SIDE INJECTION, fLO > fRF TC = -25C TC = +85C 23 INPUT IP3 (dBm) 22 21 20 19 18 400 420 440 460 480 500 RF FREQUENCY (MHz) TC = -40C TC = +25C
MAX9984 toc45
2LO-2RF RESPONSE vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
MAX9984 toc46
3LO-3RF RESPONSE vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
HIGH-SIDE INJECTION, fLO > fRF PRF = -5dBm TC = -25C TC = +25C TC = +85C
MAX9984 toc47
25 24
80 75 2LO-2RF RESPONSE (dBc) 70 65 60
HIGH-SIDE INJECTION, fLO > fRF PRF = -5dBm TC = -25C TC = +25C, +85C
75
3LO-3RF RESPONSE (dBc)
65
55 TC = -40C 45
TC = -40C 55 50 400 420 440 460 480 500 RF FREQUENCY (MHz)
35 400 420 440 460 480 500 RF FREQUENCY (MHz)
RF PORT RETURN LOSS vs. RF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
MAX9984 toc48
IF PORT RETURN LOSS vs. IF FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
MAX9984 toc49
LO SELECTED RETURN LOSS vs. LO FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
VCC = 5.0V, PLO = 0dBm, TC = +25C HIGH-SIDE INJECTION, fLO > fRF
MAX9984 toc50
0 5 RF PORT RETURN LOSS (dB) 10 15 20 25 30
0
VCC = 5.0V, PLO = 0dBm, TC = +25C HIGH-SIDE INJECTION, fRF > fLO
VCC = 5.0V, PLO = 0dBm, TC = +25C HIGH-SIDE INJECTION, fLO > fRF
0 LO SELECTED RETURN LOSS (dB) 5 10 15 20 25 30
IF PORT RETURN LOSS (dB)
10
20
30
40 400 420 440 460 480 500 50 100 150 200 RF FREQUENCY (MHz) IF FREQUENCY (MHz)
475
495
515
535
555
575
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS vs. LO FREQUENCY (TUNED FOR 400MHz TO 500MHz RF FREQUENCY)
VCC = 5.0V, PLO = 0dBm, TC = +25C HIGH-SIDE INJECTION, fLO > fRF
MAX9984 toc51
0 LO UNSELECTED RETURN LOSS (dB) 5 10 15 20 25 30
475
495
515
535
555
575
LO FREQUENCY (MHz)
_______________________________________________________________________________________
9
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
Pin Description
PIN 1, 6, 8, 14 2 3 4, 5, 10, 12, 13, 17 7 9 11 15 16 18, 19 20 EP NAME VCC RF TAP GND LOBIAS LOSEL LO1 LO2 LEXT IF-, IF+ IFBIAS GND FUNCTION Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit. Single-Ended 50 RF Input. This port is internally matched and DC shorted to GND through a balun. Requires an external DC-blocking capacitor. Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the Typical Application Circuit. Ground Bias Resistor for Internal LO Buffer. Connect a 619 1% resistor from LOBIAS to the power supply. Local Oscillator Select. Logic control input for selecting LO1 or LO2. Local Oscillator Input 1. Drive LOSEL low to select LO1. Local Oscillator Input 2. Drive LOSEL high to select LO2. External Inductor Connection. Connect a low-ESR, 47nH inductor from LEXT to GND. This inductor carries approximately 140mA DC current. Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the Typical Application Circuit). IF Bias Resistor Connection for IF Amplifier. Connect a 953 1% resistor from IFBIAS to GND. Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
Detailed Description
The MAX9984 high-linearity downconversion mixer provides 8.1dB of conversion gain and +25dBm of IIP3, with a typical 9.3dB noise figure. The integrated baluns and matching circuitry allow for 50 singleended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 54dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9984's inputs to a -3dBm to +3dBm range. The IF port incorporates a differential output, which is ideal for providing enhanced IIP2 performance. Specifications are guaranteed over broad frequency ranges to allow for use in cellular band GSM, cdma2000, iDEN, and W-CDMA 2G/2.5G/3G base stations. The MAX9984 is optimized to operate over a 815MHz to 1000MHz RF frequency range, a 570MHz to 850MHz LO frequency range, and a 50MHz to 250MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional details. For operation at a 400MHz to 500MHz RF frequency range, see the Typical Operating Characteristics and Table 2 for details.
RF Input and Balun
The MAX9984 RF input is internally matched to 50, requiring no external matching components. A DCblocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun.
LO Inputs, Buffer, and Balun
The MAX9984 is ideally suited for low-side LO injection applications with an optimized 570MHz to 850MHz LO frequency range. Appropriate tuning allows for an LO frequency range below 570MHz (RF frequency below 815MHz). For a device with a 960MHz to 1180MHz LO frequency range, refer to the MAX9986 data sheet. As an added feature, the MAX9984 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two singleended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. To avoid damage to the part, voltage must be applied to VCC before digital logic is applied to LOSEL. LO1 and LO2 inputs are internally matched to 50, requiring only a 82pF DC-blocking capacitor.
10
______________________________________________________________________________________
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch
A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip.
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leakage. The inductance value can be adjusted by the user to optimize the performance for a particular frequency band. Since approximately 140mA flows through this inductor, it is important to use a low-DCR wire-wound coil. If the LO-to-IF and RF-to-IF leakage are not critical parameters, the inductor can be replaced by a short circuit to ground.
MAX9984
High-Linearity Mixer
The core of the MAX9984 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2RF-2LO rejection, and NF performance is typically 25dBm, 71dBc, and 9.3dB, respectively.
Layout Considerations
A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9984 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com.
Differential IF Output Amplifier
The MAX9984 mixer has a 50MHz to 250MHz IF frequency range. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2RF-2LO rejection performance. Singleended IF applications require a 4:1 balun to transform the 200 differential output impedance to a 50 singleended output.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50. No matching components are required for an 815MHz to 1000MHz RF frequency range. RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50 singleended output (see the Typical Application Circuit). Capacitor CP is used at the RF input port to tune the mixer down to operate in the 400MHz to 500MHz RF frequency range (see Table 2). Operation between 500MHz to 815MHz would require a smaller capacitor CP. Contact the factory for details.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin.
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9984's 20-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9984 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PC board, either directly or through an array of plated via holes.
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning resistors R1 and R2. If reduced current is required at the expense of performance, contact the factory for details. If the 1% bias resistor values are not readily available, substitute standard 5% values. TRANSISTOR COUNT: 1017 PROCESS: SiGe BiCMOS
Chip Information
______________________________________________________________________________________
11
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
Table 1. Component List Referring to the Typical Application Circuit for 815MHz to 1000MHz RF Frequency Operation
COMPONENT L1, L2 L3 C1 C2, C4, C7, C8, C10, C11, C12 C3, C5, C6, C9, C13, C14 C15 R1 R2 R3 T1 U1 VALUE 330nH 47nH 10pF 82pF 0.01F 220pF 953 619 3.57 4:1 balun MAX9984 DESCRIPTION Wire-wound high-Q inductors (0805) Wire-wound high-Q inductor (0603) Microwave capacitor (0603) Microwave capacitors (0603) Microwave capacitors (0603) Microwave capacitor (0402) 1% resistor (0603) 1% resistor (0603) 1% resistor (1206) IF balun (TC4-1W-7A) Maxim IC
Table 2. Component List Referring to the Typical Application Circuit for 400MHz to 995MHz RF Frequency Operation
COMPONENT L1, L2 L3 CP C1 C2, C4, C7, C8, C10, C11, C12 C3, C5, C6, C9, C13, C14 C15 R1 R2 R3 T1 U1 VALUE 820nH 47nH 7pF 56pF 220pF 10nF 220pF 953 619 3.57 4:1 balun MAX9984 DESCRIPTION Wire-wound high-Q inductors (0805) Wire-wound high-Q inductor (0603) Microwave capacitor (0603) Microwave capacitor (0603) Microwave capacitors (0603) Microwave capacitors (0603) Microwave capacitor (0402) 1% resistor (0603) 1% resistor (0603) 1% resistor (1206) IF balun (TC4-1W-7A) Maxim IC
12
______________________________________________________________________________________
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
Pin Configuration/Functional Diagram
IFBIAS LEXT 16 GND 17 IF+ 19 IF18
20
VCC 1 RF 2 TAP 3 GND 4 GND 5 MAX9984
15 LO2 14 VCC 13 GND 12 GND 11 LO1
6 VCC
7 LOBIAS
8 VCC
9 LOSEL
10 GND
THIN QFN
______________________________________________________________________________________
13
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch MAX9984
Typical Application Circuit
VCC T1 3 R3 L1 C13 C14 L2 R1 IFBIAS C15 1 L3 LEXT GND IF+ IF4 2 6 IF OUTPUT
VCC
20
19
18
17
16
C3 C1 RF INPUT CP* C5
C2
VCC RF TAP
C12 1 MAX9984 2 3 4 5 14 13 12 11 15 LO2 VCC GND GND C10 LO1 LO1 INPUT C11 LO2 INPUT VCC
C4
GND GND
6 LOBIAS VCC
7 VCC
8 LOSEL
9
10 GND
R2 VCC C6 C7 LOSEL INPUT
C8 C9
VCC
*CP NEEDED FOR 400MHz TO 500MHz RF FREQUENCY OPERATION. SEE TABLE 2.
14
______________________________________________________________________________________
SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
QFN THIN.EPS
MAX9984
D2 D D/2 MARKING k L E/2 E2/2 E (NE-1) X e
C L C L
b D2/2
0.10 M C A B
XXXXX
E2
PIN # 1 I.D.
DETAIL A
e (ND-1) X e
e/2
PIN # 1 I.D. 0.35x45 DETAIL B
e
L1
L
C L
C L
L
L
e 0.10 C A 0.08 C
e
C
A1 A3 PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
21-0140
H
1
2
COMMON DIMENSIONS
PKG. 16L 5x5 20L 5x5 28L 5x5 32L 5x5 40L 5x5 SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX.
EXPOSED PAD VARIATIONS PKG. CODES T1655-1 T1655-2 T1655N-1 T2055-2 T2055-3 T2055-4 T2055-5 T2855-1 T2855-2 T2855-3 T2855-4 T2855-5 T2855-6 T2855-7 T2855-8 T2855N-1 T3255-2 T3255-3 T3255-4 T3255N-1 T4055-1
D2
MIN. NOM. MAX. MIN.
E2
NOM. MAX.
L
0.15
A A1 A3 b D E e k L L1 N ND NE JEDEC
NOTES:
DOWN BONDS ALLOWED
0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0.20 REF. 0.25 0.30 0.35 4.90 5.00 5.10 4.90 5.00 5.10 0.80 BSC. 0.25 0.20 REF. 0.20 REF. 0.20 REF. 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.50 BSC. 0.65 BSC. 0.50 BSC. - 0.25 - 0.25 0.25 0.20 REF. 0.15 0.20 0.25 4.90 5.00 5.10 4.90 5.00 5.10 0.40 BSC. 0.25 0.35 0.45
3.00 3.00 3.00 3.00 3.00 3.00 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.20
3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00
3.10 3.10 3.10 3.10 3.10 3.10 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.30
3.20 3.20 3.20 3.20 3.20 3.20 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.40
** ** ** ** ** ** 0.40 ** ** ** ** ** ** ** 0.40 ** ** ** ** ** **
NO YES NO NO YES NO YES NO NO YES YES NO NO YES YES NO NO YES NO NO YES
0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 0.40 0.50 0.60 - 0.30 0.40 0.50 16 4 4 WHHB 20 5 5 WHHC 28 7 7 WHHD-1 32 8 8 WHHD-2 40 10 10 -----
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3, AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. 13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", 0.05.
3.30 3.40 3.20
** SEE COMMON DIMENSIONS TABLE
PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
21-0140
H
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15 (c) 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.

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